查询包含合并状态信息概念体系节点树

{"body":{"nodeId":"697443b83a91b861e14dae217a01ec4d","parentId":"root","nodeCount":null,"name":"集成电路","englishName":"","knowledgeLabel":null,"description":"集成电路（integrated circuit）是一种微型电子器件或部件。采用一定的工艺，把一个电路中所需的晶体管、电阻、电容和电感等元件及布线互连一起，制作在一小块或几小块半导体晶片或介质基片上，然后封装在一个管壳内，成为具有所需电路功能的微型结构；其中所有元件在结构上已组成一个整体，使电子元件向着微小型化、低功耗、智能化和高可靠性方面迈进了一大步。它在电路中用字母“IC”表示。","level":0,"desc":null,"alterName":null,"chineseSemanticRule":null,"englisSemanticRule":null,"englishSemanticRule":null,"keywordExclude":null,"knowledgeBottleneck":null,"teckParam":null,"version":1.6,"changedStatus":0,"mergedStatus":0,"isHooked":0,"children":[{"nodeId":"abe53b2a4fa2695c286beb5f46f6cdf3","parentId":"697443b83a91b861e14dae217a01ec4d","nodeCount":null,"name":"中游","englishName":"","knowledgeLabel":null,"description":"","level":1,"desc":null,"alterName":null,"chineseSemanticRule":null,"englisSemanticRule":null,"englishSemanticRule":null,"keywordExclude":null,"knowledgeBottleneck":null,"teckParam":null,"version":1.6,"changedStatus":0,"mergedStatus":0,"isHooked":0,"children":[{"nodeId":"9b13a28e461b0caa682176d505c560b3","parentId":"abe53b2a4fa2695c286beb5f46f6cdf3","nodeCount":null,"name":"集成电路制造","englishName":"","knowledgeLabel":null,"description":"集成电路制造是指集成电路制造过程中由单台设备或单个反应腔室（Chamber）即可完成的工艺步骤","level":2,"desc":null,"alterName":null,"chineseSemanticRule":null,"englisSemanticRule":null,"englishSemanticRule":null,"keywordExclude":null,"knowledgeBottleneck":null,"teckParam":null,"version":1.6,"changedStatus":0,"mergedStatus":0,"isHooked":0,"children":[{"nodeId":"00683859edc5806baf892e045ff76235","parentId":"9b13a28e461b0caa682176d505c560b3","nodeCount":null,"name":"集成电路晶圆代工","englishName":"","knowledgeLabel":null,"description":"晶圆代工就是向专业的集成电路设计公司或电子厂商提供专门的制造服务。","level":3,"desc":null,"alterName":null,"chineseSemanticRule":["晶圆|代工","硅晶|代工","晶圆|生产","硅晶|生产"],"englisSemanticRule":null,"englishSemanticRule":["Wafer|Foundry","Silicon|Foundry","Wafer|Production","Silicon|Production"],"keywordExclude":null,"knowledgeBottleneck":null,"teckParam":null,"version":1.6,"changedStatus":0,"mergedStatus":0,"isHooked":0,"children":null,"isRiskNode":0,"riskLevel":null},{"nodeId":"5969986c3af7cf6906975382ee048745","parentId":"9b13a28e461b0caa682176d505c560b3","nodeCount":null,"name":"垂直整合制造（IDM）","englishName":"","knowledgeLabel":null,"description":"IDM (Integrated Device Manufacture)即垂直整合制造模式，IDM企业集芯片设计、芯片制造、芯片封装和测试等多个产业链环节于一身，仅有极少数企业能够维持这种模式。","level":3,"desc":null,"alterName":null,"chineseSemanticRule":["垂直整合|制造"],"englisSemanticRule":null,"englishSemanticRule":["Vertical Integration|Manufacturing"],"keywordExclude":null,"knowledgeBottleneck":null,"teckParam":null,"version":1.6,"changedStatus":0,"mergedStatus":0,"isHooked":0,"children":null,"isRiskNode":0,"riskLevel":null}],"isRiskNode":0,"riskLevel":null}],"isRiskNode":0,"riskLevel":null},{"nodeId":"be01e5e0031e92c29f743dc0f4c36ee0","parentId":"697443b83a91b861e14dae217a01ec4d","nodeCount":null,"name":"下游","englishName":"","knowledgeLabel":null,"description":"","level":1,"desc":null,"alterName":null,"chineseSemanticRule":null,"englisSemanticRule":null,"englishSemanticRule":null,"keywordExclude":null,"knowledgeBottleneck":null,"teckParam":null,"version":1.6,"changedStatus":0,"mergedStatus":0,"isHooked":0,"children":[{"nodeId":"6ee7f79882644a6616053477d308e356","parentId":"be01e5e0031e92c29f743dc0f4c36ee0","nodeCount":null,"name":"集成电路封装测试","englishName":"","knowledgeLabel":null,"description":"集成电路封装测试在电子学金字塔中的位置既是金字塔的尖顶又是金字塔的基座。说它同时处在这两种位置都有很充分的根据。从电子元器件（如晶体管）的密度这个角度上来说，IC代表了电子学的尖端。但是IC又是一个起始点，是一种基本结构单元，是组成我们生活中大多数电子系统的基础。同样，IC不仅仅是单块芯片或者基本电子结构，IC的种类千差万别（模拟电路、数字电路、射频电路、传感器等），因而对于封装的需求和要求也各不相同。本文对IC封装技术做了全面的回顾，以粗线条的方式介绍了制造这些不可缺少的封装结构时用到的各种材料和工艺。","level":2,"desc":null,"alterName":null,"chineseSemanticRule":null,"englisSemanticRule":null,"englishSemanticRule":null,"keywordExclude":null,"knowledgeBottleneck":null,"teckParam":null,"version":1.6,"changedStatus":0,"mergedStatus":0,"isHooked":0,"children":[{"nodeId":"c93ce57c9960cb378bcbfff1c1f1ae41","parentId":"6ee7f79882644a6616053477d308e356","nodeCount":null,"name":"集成电路封装","englishName":"","knowledgeLabel":null,"description":"集成电路封装在电子学金字塔中的位置既是金字塔的尖顶又是金字塔的基座。说它同时处在这两种位置都有很充分的根据。从电子元器件（如晶体管）的密度这个角度上来说，IC代表了电子学的尖端。但是IC又是一个起始点，是一种基本结构单元，是组成我们生活中大多数电子系统的基础。同样，IC不仅仅是单块芯片或者基本电子结构，IC的种类千差万别（模拟电路、数字电路、射频电路、传感器等），因而对于封装的需求和要求也各不相同。本文对IC封装技术做了全面的回顾，以粗线条的方式介绍了制造这些不可缺少的封装结构时用到的各种材料和工艺。","level":3,"desc":null,"alterName":null,"chineseSemanticRule":["集成电路|封装","IC封装"],"englisSemanticRule":null,"englishSemanticRule":["Integrated Circuits|Package","IC|Package"],"keywordExclude":null,"knowledgeBottleneck":null,"teckParam":null,"version":1.6,"changedStatus":0,"mergedStatus":0,"isHooked":0,"children":[{"nodeId":"85a5496beb1acb2b5350ca2e60946861","parentId":"c93ce57c9960cb378bcbfff1c1f1ae41","nodeCount":null,"name":"先进芯片封装","englishName":"","knowledgeLabel":null,"description":"包括倒装（FlipChip），凸块（Bumping），晶圆级封装（Waferlevelpackage），2.5D封装（interposer，RDL等），3D封装（TSV）等封装技术","level":4,"desc":null,"alt